Effects of Lanthanum Doping on the Microstructure and Mechanical Behavior of a SnAg Alloy
Lead-free solders such as SnAg and SnAgCu are used extensively as replacements of SnPb solders in microelectronics packaging. But these alloys have several drawbacks, such as poor wetting ability and formation of intermetallic compounds (IMC). Doping of rare earth element (RE) on SnAg alloys has bee...
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Georgia Institute of Technology
2007
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| Online Access: | http://hdl.handle.net/1853/14524 |