High throughput flip chip assembly process application and assessment using no-flow underfill materials

High throughput flip chip assembly process application and assessment using no-flow underfill materials

Bibliographic Details
Main Author: Milner, David William
Published: Georgia Institute of Technology 2007
Subjects:
Electronic apparatus and appliances Packaging
Integrated circuits
Online Access:http://hdl.handle.net/1853/16359

Internet

http://hdl.handle.net/1853/16359

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