Study of thermo-mechanical reliability of area-array packages

Study of thermo-mechanical reliability of area-array packages

Bibliographic Details
Main Author: Hanna, Carlton Eissey
Published: Georgia Institute of Technology 2007
Subjects:
Integrated circuits Design and construction
Electronic packaging
Microelectronic packaging
Multichip modules (Microelectronics)
Online Access:http://hdl.handle.net/1853/16841

Internet

http://hdl.handle.net/1853/16841

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