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An automated system for measuring PWB/PWBA warpage during simulation of the infrared reflow and wave soldering processes, and during operational thermal cycling

An automated system for measuring PWB/PWBA warpage during simulation of the infrared reflow and wave soldering processes, and during operational thermal cycling

Bibliographic Details
Main Author: Stiteler, Michael Ross
Published: Georgia Institute of Technology 2007
Subjects:
Printed circuits
Electronic circuits
Electronic packaging
Online Access:http://hdl.handle.net/1853/17099
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Internet

http://hdl.handle.net/1853/17099

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