Thermo-mechanical evaluation of interfacial integrity in multilayered microelectronic packages

Thermo-mechanical evaluation of interfacial integrity in multilayered microelectronic packages

Bibliographic Details
Main Author: Xie, Weidong
Published: Georgia Institute of Technology 2007
Subjects:
Electronic packaging Thermal properties
Electronic packaging Testing
Online Access:http://hdl.handle.net/1853/17380

Internet

http://hdl.handle.net/1853/17380

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