High throughput flip chip assembly process and reliability analysis using no-flow underfill materials

High throughput flip chip assembly process and reliability analysis using no-flow underfill materials

Bibliographic Details
Main Author: Thorpe, Ryan
Published: Georgia Institute of Technology 2007
Subjects:
Electronic packaging Materials
Electronic packaging Reliability
Surface mount technology
Online Access:http://hdl.handle.net/1853/17514

Internet

http://hdl.handle.net/1853/17514

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