A study of the thermo-mechanical behavior of a plated through-hole under solder shock testing
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Georgia Institute of Technology
2007
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Online Access: | http://hdl.handle.net/1853/17631 |
Main Author: | |
---|---|
Published: |
Georgia Institute of Technology
2007
|
Subjects: | |
Online Access: | http://hdl.handle.net/1853/17631 |