No-flow underfill materials for environment sensitive flip-chip process

No-flow underfill materials for environment sensitive flip-chip process

Bibliographic Details
Main Author: Zhang, Zhuqing
Published: Georgia Institute of Technology 2008
Subjects:
Electronic packaging Environmental aspects
Online Access:http://hdl.handle.net/1853/19084

Internet

http://hdl.handle.net/1853/19084

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