Predictive Modeling for Ductile Machining of Brittle Materials
Brittle materials such as silicon, germanium, glass and ceramics are widely used in semiconductor, optical, micro-electronics and various other fields. Traditionally, grinding, polishing and lapping have been employed to achieve high tolerance in surface texture of silicon wafers in semiconductor ap...
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Georgia Institute of Technology
2008
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| Online Access: | http://hdl.handle.net/1853/19774 |