Copper to copper bonding by nano interfaces for fine pitch interconnections and thermal applications
Ever growing demands for portability and functionality have always governed the electronic technology innovations. IC downscaling with Moore s law at IC level and system miniaturization with System-On-Package (SOP) paradigm at system level, have resulted and will continue to result in ultraminiaturi...
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Georgia Institute of Technology
2008
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| Online Access: | http://hdl.handle.net/1853/22588 |