Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications
This thesis is devoted to the research and development of low processing temperature lead-free interconnect materials for microelectronic packaging applications with an emphasis on fundamental studies of nanoparticles synthesis, dispersion and oxidation prevention, and nanocomposites fabrication....
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Georgia Institute of Technology
2008
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| Online Access: | http://hdl.handle.net/1853/22636 |