Analysis of handling stresses and breakage of thin crystalline silicon wafers

Analysis of handling stresses and breakage of thin crystalline silicon wafers

Photovoltaic manufacturing is material intensive with the cost of crystalline silicon wafer, used as the substrate, representing 40% to 60% of the solar cell cost. Consequently, there is a growing trend to reduce the silicon wafer thickness leading to new technical challenges related to manufacturin...

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Bibliographic Details
Main Author: Brun, Xavier F.
Published: Georgia Institute of Technology 2009
Subjects:
Wafer breakage
Bernoulli gripper
Wafer handling
Finite element modeling
Computational fluid dynamics
Silicon solar cells
Semiconductor wafers Mechanical properties
Online Access:http://hdl.handle.net/1853/26538

Internet

http://hdl.handle.net/1853/26538

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