Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics
The fundamental motivation for this dissertation is to address the widening interconnect gap between integrated circuit (IC) demands and package substrates specifically for high frequency digital-RF systems applications. Moore's law for CMOS ICs predicts that transistor density on ICs will doub...
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Georgia Institute of Technology
2009
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| Online Access: | http://hdl.handle.net/1853/28141 |