Sundaram, V. (2009). Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics. Georgia Institute of Technology.
Chicago Style (17th ed.) CitationSundaram, Venkatesh. Advances in Electronic Packaging Technologies by Ultra-small Microvias, Super-fine Interconnections and Low Loss Polymer Dielectrics. Georgia Institute of Technology, 2009.
MLA (8th ed.) CitationSundaram, Venkatesh. Advances in Electronic Packaging Technologies by Ultra-small Microvias, Super-fine Interconnections and Low Loss Polymer Dielectrics. Georgia Institute of Technology, 2009.
Warning: These citations may not always be 100% accurate.