Signal and power integrity co-simulation using the multi-layer finite difference method

Signal and power integrity co-simulation using the multi-layer finite difference method

Mixed signal system-on-package (SoP) technology is a key enabler for increasing functional integration, especially in mobile and wireless systems. Due to the presence of multiple dissimilar modules, each having unique power supply requirements, the design of the power distribution network (PDN) beco...

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Bibliographic Details
Main Author: Bharath, Krishna
Published: Georgia Institute of Technology 2009
Subjects:
System on package
Simultaneous switching noise
SSN
Signal integrity
Finite difference
Power integrity
Power ground planes
Finite elements
Finite differences
Microelectronic packaging
Electric power supplies to apparatus
Wireless communication systems
Interconnects (Integrated circuit technology)
Online Access:http://hdl.handle.net/1853/28155

Internet

http://hdl.handle.net/1853/28155

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