Fundamental study of underfill void formation in flip chip assembly
Flip Chip in Package (FCIP) has been developed to achieve the assembly process with area array interconnects. Particularly, a high I/O count coupled with finer pitch area array interconnects structured FCIP can be achieved using no-flow underfill assembly process. Using the assembly process, a high,...
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Georgia Institute of Technology
2009
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| Online Access: | http://hdl.handle.net/1853/29755 |