Electromigration analysis of high current carrying adhesive-based copper-to-copper interconnections
"More Than Moore's Law" is the driving principle for the electronic packaging industry. This principle focuses on system integration instead of transistor density in order to achieve faster, thinner, and smarter electronic devices at a low cost. A core area of electronics packaging is...
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Georgia Institute of Technology
2012
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| Online Access: | http://hdl.handle.net/1853/44885 |