Fundamental investigations of cutting of silicon for photovoltaic applications

Crystalline silicon (Si) wafers used as substrates in the semiconductor and photovoltaic (PV) industries are traditionally manufactured using a multi-wire slurry sawing (MWSS) technique. Due to its high productivity potential, the fixed abrasive diamond wire sawing (DWS) technique is of considerable...

Full description

Bibliographic Details
Main Author: Wu, Hao
Published: Georgia Institute of Technology 2013
Subjects:
Online Access:http://hdl.handle.net/1853/45855