CAD methodologies for low power and reliable 3D ICs

CAD methodologies for low power and reliable 3D ICs

The main objective of this dissertation is to explore and develop computer-aided-design (CAD) methodologies and optimization techniques for reliability, timing performance, and power consumption of through-silicon-via(TSV)-based and monolithic 3D IC designs. The 3D IC technology is a promising answe...

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Bibliographic Details
Main Author: Lee, Young-Joon
Published: Georgia Institute of Technology 2013
Subjects:
Physical design
Low power
CAD
3D IC
Three-dimensional integrated circuits Computer-aided design
Online Access:http://hdl.handle.net/1853/47635

Internet

http://hdl.handle.net/1853/47635

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