Effect of intermetallic compounds on thermomechanical reliability of lead-free solder interconnects for flip-chips
Georgia Techs Packaging Research Centers vision of System on Package (SOP) requires that the ball grid array (BGA) package be eliminated and the integrated circuit (IC) directly assembled on the printed wiring board (PWB). Flip-Chip on board (FCOB) emerges as a viable solution which meets the indust...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1853/4800 |