Moisture and Interfacial Adhesion in Microelectronic Assemblies
In this research, a systematic and multi-disciplinary study was conducted to understand the fundamental science of moisture-induced degradation of interfacial adhesion. The research is comprised of both experimental and modeling components of analysis and consists of four primary components. First,...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1853/5003 |