Interconnect Thermal Management of High Power Packaged Electronic Architectures
Packaged microelectronic technology provides an efficient means to connecting high performance chips to PCBs. As area array bump density increases, joule heating will play an important role in chip and interconnect reliability. Joule heating, in addition to chip heating can significantly reduce th...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1853/5013 |