Characterization and measurements of advanced vertically aligned carbon nanotube based thermal interface materials
It has been known that a significant part of the thermal budget of an electronic package is occupied by the thermal interface material which is used to join different materials. Research in reducing this resistance through the use of vertically aligned multiwall carbon nanotube based thermal interfa...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2014
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| Online Access: | http://hdl.handle.net/1853/50386 |