Evaluation, Optimization,and Reliability of No-flow Underfill Process
This research details the development of a novel process for four commercially available no-flow fluxing underfills for use with flip chip on FR4 substrates. The daisy chain test die was used such that two point resistance measurements could be used to determine the integrity of the solder interconn...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1853/5132 |