Electroplated multi-path compliant copper interconnects for flip-chip packages

Electroplated multi-path compliant copper interconnects for flip-chip packages

The international technology roadmap for semiconductors (ITRS) 2012 report foresees the use of porous dielectric materials with a low dielectric constant in conjunction with copper interconnects as a way to reduce the resistive-capacitive (RC) delay in microelectronic applications. However, the intr...

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Bibliographic Details
Main Author: Okereke, Raphael Ifeanyi
Other Authors: Sitaraman, Suresh K.
Format: Others
Language:en_US
Published: Georgia Institute of Technology 2014
Subjects:
Compliant interconnects
Flip-chip technology
Delta interconnects
Copper/Low-k compatible technology
Low die stress
White bump solution
MEMS
CMOS compatible
Interconnects (Integrated circuit technology)
Copper
Online Access:http://hdl.handle.net/1853/51800

Internet

http://hdl.handle.net/1853/51800

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