Copper, silver, and gold etching with H₂ and CH₄ based plasmas
This thesis describes investigations on Cu, Ag, and Au subtractive etching by H₂ and CH₄ plasmas below room temperature. Both blanket film of Cu, Ag, and Au etching and patterning studies were performed for the applications of these metals as interconnects in electronic devices and photonic devices...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2015
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| Online Access: | http://hdl.handle.net/1853/53043 |