Improvements for chip-chip interconnects and MEMS packaging through MEMS materials and processing research

Improvements for chip-chip interconnects and MEMS packaging through MEMS materials and processing research

Improvements for Chip-Chip Interconnects and MEMS Packaging Through Materials and Processing Research Erdal Uzunlar 129 Pages Directed by Dr. Paul A. Kohl The work presented in this dissertation focuses on improvements for ever-evolving modern microelectronic technology. Specifically, three to...

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Bibliographic Details
Main Author: Uzunlar, Erdal
Other Authors: Kohl, Paul A.
Format: Others
Language:en_US
Published: Georgia Institute of Technology 2015
Subjects:
Interconnects
MEMS packaging
Electroless copper
Sacrificial polymer
Online Access:http://hdl.handle.net/1853/53509

Internet

http://hdl.handle.net/1853/53509

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