Improvements for chip-chip interconnects and MEMS packaging through MEMS materials and processing research
Improvements for Chip-Chip Interconnects and MEMS Packaging Through Materials and Processing Research Erdal Uzunlar 129 Pages Directed by Dr. Paul A. Kohl The work presented in this dissertation focuses on improvements for ever-evolving modern microelectronic technology. Specifically, three to...
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Language: | en_US |
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Georgia Institute of Technology
2015
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Online Access: | http://hdl.handle.net/1853/53509 |