Acquisition and analysis of ultrasonic wavefield data to characterize angle-beam propagation and scattering in plates
A method for acquiring and analyzing ultrasonic wavefields to characterize scattering from defects is described. A laser vibrometer and XY scanner are used to record high resolution wavefield data for angle-beam waves propagating in both a defect-free plate and a plate containing crack-like defects...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2016
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| Online Access: | http://hdl.handle.net/1853/54345 |