Modeling, design, fabrication and characterization of power delivery networks and resonance suppression in double-sided 3-D glass interposer packages
Effective power delivery in Double-sided 3-D glass interposer packages was proposed, investigated, and demonstrated towards achieving high logic-to-memory bandwidth. Such 3-D interposers enable a simpler alternative to direct 3-D stacking by providing low-loss, wide-I/O channels between the logic de...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2016
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| Online Access: | http://hdl.handle.net/1853/54356 |