Power distribution network modeling and microfluidic cooling for high-performance computing systems
A silicon interposer platform with microfluidic cooling is proposed for high-performance computing systems. The key components and technologies for the proposed platform, including electrical and fluidic microbumps, microfluidic vias and heat sinks, and simultaneous flip-chip bonding of the electric...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2016
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| Online Access: | http://hdl.handle.net/1853/54449 |