Quality assessments of solder bump interconnections in ball grid array packages using laser ultrasonics and laser interferometer
Surface mount devices (SMDs), such as flip chip packages and ball grid array (BGA) packages are gaining in popularity in microelectronics industry because they provide high density inputs/outputs, better electrical and thermal performance. However, these solder bump interconnections in SMDs are sand...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2016
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| Online Access: | http://hdl.handle.net/1853/54914 |