Measurement and analysis of wire sawing induced residual stress in photovoltaic silicon wafers
The manufacturing process of a photovoltaic Si wafer comprises of first a high temperature heating process to produce a Si ingot from polycrystalline Silicon, which is then cut into bricks and subsequently sawn into wafers using a wire saw. These processes create residual stresses both from the ther...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2016
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| Online Access: | http://hdl.handle.net/1853/55071 |