Microelectronics Device Inspection System Implementation and Modeling for Flip Chips and Multi-Layer Ceramic Capacitors
Increased demand for smaller electronics is driving the electronic packaging industry to develop smaller, more efficient component level packages. Surface mounted components, such as flip chips, ball grid arrays (BGAs), and chip-scale packages (CSPs), are being developed for use in high-volume prod...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1853/6902 |