Investigation of Copper Foam Coldplates as a High Heat Flux Electronics Cooling Solution
Compact heat exchangers such as porous foam coldplates have great potential as a high heat flux cooling solution for electronics due to their large surface area to volume ratio and tortuous coolant path. The focus of this work was the development of unit cell modeling techniques for predicting the...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1853/6944 |