Parâmetros térmicos de solidificação, microestrutura e resistência mecânica de ligas eutéticas Sn-0,7%Cu-(xNi)
Made available in DSpace on 2016-06-02T19:12:32Z (GMT). No. of bitstreams: 1 5520.pdf: 15957813 bytes, checksum: 79aec06af1bae5d8465f546113e03184 (MD5) Previous issue date: 2013-07-29 === Sn-Pb traditional solder alloys were overly utilize in electronic devices industry, since their properties and...
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| Format: | Others |
| Language: | Portuguese |
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Universidade Federal de São Carlos
2016
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| Online Access: | https://repositorio.ufscar.br/handle/ufscar/910 |