Stress and Microstructural Evolution During the Growth of Transition Metal Oxide Thin Films by PVD

Stress and Microstructural Evolution During the Growth of Transition Metal Oxide Thin Films by PVD

System on Chip (SoC) and System in Package (SiP) are two electronic technologies that involve integrating multiple functionalities onto a single platform. When the platform is a single wafer, as in SOC, it requires the ability to deposit various materials that enable the different functions on to an...

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Bibliographic Details
Main Author: Narayanachari, K V L V
Other Authors: Raghavan, Srinivasan
Language:en_US
Published: 2018
Subjects:
Transition Metal Oxide Thin Films
System On Chip (SoC)
System on Package (SiP)
Thin Film Deposition
Ultra High Vacuum Thin Film Deposition
Pulsed Laser Ablation
Sputter Deposition
Oxide Thin Film Growth
Oxides On Silicon
Physical Vapor Deposition
ZrO2 Thin Films
ZrO2/Ge Thin Films
BaTiO3 Thin Films
SrTiO3 Thin Films
Materials Science
Online Access:http://etd.iisc.ernet.in/2005/3590
http://etd.iisc.ernet.in/abstracts/4458/G27329-Abs.pdf

Internet

http://etd.iisc.ernet.in/2005/3590
http://etd.iisc.ernet.in/abstracts/4458/G27329-Abs.pdf

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