Diffusion-Controlled Growth of Phases in Metal-Tin Systems Related to Microelectronics Packaging

Diffusion-Controlled Growth of Phases in Metal-Tin Systems Related to Microelectronics Packaging

The electro–mechanical connection between under bump metallization (UBM) and solder in flip–chip bonding is achieved by the formation of brittle intermetallic compounds (IMCs) during the soldering process. These IMCs continue to grow in the solid–state during storage at room temperature and service...

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Bibliographic Details
Main Author: Baheti, Varun A
Other Authors: Paul, Aloke
Language:en_US
Published: 2018
Subjects:
Electroplating - Copper Deposition
Electroplating - Tin Deposition
Kirkendall Voids
Solid-state Diffusion-controlled Growth
Melanocyte Pigmentation
Cu–Sn Systems
Ni–Sn Systems
Au–Sn Systems
Pd–Sn Systems
Pt–Sn Systems
Cu–Sn System
Cu(Ni)–Sn System
Co–Ni–Ta System
Co–Ta System
Materials Engineering
Online Access:http://etd.iisc.ernet.in/2005/3985
http://etd.iisc.ernet.in/abstracts/4873/G28646-Abs.pdf

Internet

http://etd.iisc.ernet.in/2005/3985
http://etd.iisc.ernet.in/abstracts/4873/G28646-Abs.pdf

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