Multi-scale thermal and circuit analysis for nanometre-scale integrated circuits

Chip temperature is increasing with continued technology scaling due to increased power density and decreased device feature sizes. Since temperature has significant impact on performance and reliability, accurate thermal and circuit analysis are of great importance. Due to the shrinking device feat...

Full description

Bibliographic Details
Main Author: Allec, NICHOLAS
Other Authors: Queen's University (Kingston, Ont.). Theses (Queen's University (Kingston, Ont.))
Format: Others
Language:en
en
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/1974/1508