Multi-scale thermal and circuit analysis for nanometre-scale integrated circuits
Chip temperature is increasing with continued technology scaling due to increased power density and decreased device feature sizes. Since temperature has significant impact on performance and reliability, accurate thermal and circuit analysis are of great importance. Due to the shrinking device feat...
Main Author: | Allec, NICHOLAS |
---|---|
Other Authors: | Queen's University (Kingston, Ont.). Theses (Queen's University (Kingston, Ont.)) |
Format: | Others |
Language: | en en |
Published: |
2008
|
Subjects: | |
Online Access: | http://hdl.handle.net/1974/1508 |
Similar Items
-
The Software Reliability of Large Scale Integration Circuit and Very Large Scale Integration Circuit
by: Artem Ganiyev, et al.
Published: (2010-01-01) -
Transient Thermal Analysis of the Circuit Breaker Current Path with the Use of FEA Simulation
by: Michał Szulborski, et al.
Published: (2021-04-01) -
Analytical and Numerical Techniques for the Optimal Design of Mineral Separation Circuits
by: Noble, Christopher Aaron
Published: (2013) -
Matlab Symbolic Circuit Analysis and Simulation Tool Using PSpice Netlist for Circuits Optimization
by: Ogri J. Ushie, et al.
Published: (2015-04-01) -
Matlab Symbolic Circuit Analysis and Simulation Tool Using PSpice Netlist for Circuits Optimization
by: Ogri J. Ushie, et al.
Published: (2015-04-01)