Development and Characterization of Thermally Conductive Polymeric Composites for Electronic Packaging Applications
Advancements in the semiconductor industry have lead to the miniaturization of components and increased power densities, resulting in thermal management issues. Due to this shift, finding multifunctional materials with excellent thermal conductivity and electrical resistivity are becoming increasing...
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| Language: | en_ca |
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2011
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| Online Access: | http://hdl.handle.net/1807/30534 |