Numerical Modeling of Self-heating in MOSFET and FinFET Basic Logic Gates Using Effective Thermal Conductivity
Recent trend of minimization in microprocessors has introduced increasing self-heating effects in FinFET and MOSFET transistors. To study these self-heating effects, we developed self-consistent 3D models of FinFET and MOSFET basic logic gates, and simulated steady-state thermal transport for the wo...
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| Language: | en_ca |
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2012
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| Online Access: | http://hdl.handle.net/1807/33496 |