Process Quality Improvement in Thermosonic Wire Bonding
This thesis demonstrates the feasibility of methods developed to increase the quality of the crescent bond together with the tail bond quality. Low pull force of the crescent bond limits the usage of insulated Au wire in microelectronics assembly. Premature break of the tail which results in the sto...
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| Language: | en |
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2008
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| Online Access: | http://hdl.handle.net/10012/3858 |