Mechanical and Tribological Aspects of Microelectronic Wire Bonding

Mechanical and Tribological Aspects of Microelectronic Wire Bonding

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The goal of this thesis is on improving the understanding of mechanical and tribological mechanisms in microelectronic wire bonding. In particular, it focusses on the development and application of quantitative models of ultrasonic (US) friction and interfacial wear in wire bonding. Another objectiv...

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Bibliographic Details
Main Author: Satish Shah, Aashish
Language:en
Published: 2010
Subjects:
wire bonding
thermosonic
ultrasonic
friction power
sliding distance
friction energy
microsensor
in situ tangential force
interfacial wear
low-stress bonding
Mechanical Engineering
Online Access:http://hdl.handle.net/10012/5109

Internet

http://hdl.handle.net/10012/5109

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