Mechanical and Tribological Aspects of Microelectronic Wire Bonding
The goal of this thesis is on improving the understanding of mechanical and tribological mechanisms in microelectronic wire bonding. In particular, it focusses on the development and application of quantitative models of ultrasonic (US) friction and interfacial wear in wire bonding. Another objectiv...
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| Language: | en |
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2010
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| Online Access: | http://hdl.handle.net/10012/5109 |
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