Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors
Wire bond reliability testing typically consists of aging bonds in a high temperature environment for long time periods, and removing samples at intervals to assess bond shear strength and characterize the bond cross sections. In this way, the degradation of the bond can be monitored at discrete tim...
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| Language: | en |
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2010
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| Online Access: | http://hdl.handle.net/10012/5132 |