The effects of low temperature and vacuum on the fracture behavior of organosilicate thin films
A novel load-displacement sensing instrument has been designed and fabricated to characterize the fracture properties of brittle thin films at low temperature (-30 °C) and pressure (1.6e-4 Pa). In this study, the instrument was used to investigate the effects of harsh environments on the fracture en...
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| Language: | en |
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2011
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| Online Access: | http://hdl.handle.net/10012/5919 |