Optimization of Heat Sinks with Flow Bypass Using Entropy Generation Minimization

Forced air cooling of electronic packages is enhanced through the use of extended surfaces or heat sinks that reduce boundary resistance allowing heat generating devices to operate at lower temperatures, thereby improving reliability. Unfortunately, the clearance zones or bypass regions surroundi...

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Bibliographic Details
Main Author: Hossain, Md Rakib
Format: Others
Language:en
Published: University of Waterloo 2006
Subjects:
Online Access:http://hdl.handle.net/10012/896