Optimization of Heat Sinks with Flow Bypass Using Entropy Generation Minimization
Forced air cooling of electronic packages is enhanced through the use of extended surfaces or heat sinks that reduce boundary resistance allowing heat generating devices to operate at lower temperatures, thereby improving reliability. Unfortunately, the clearance zones or bypass regions surroundi...
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Format: | Others |
Language: | en |
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University of Waterloo
2006
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Online Access: | http://hdl.handle.net/10012/896 |