Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications
Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1993, and Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993. === Includes bibliographical references (p. 207-209). === by Gregory J. Smith. === M.S.
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1721.1/12393 |