Effect of microstructure of aluminum alloys on the electromigration-limited reliability of VLSI interconnects

Effect of microstructure of aluminum alloys on the electromigration-limited reliability of VLSI interconnects

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1990. === Includes bibliographical references (leaves 210-222). === by Jaeshin Cho. === Ph.D.

Bibliographic Details
Main Author: Cho, Jaeshin
Other Authors: Carl V. Thompson.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2005
Subjects:
Materials Science and Engineering
Online Access:http://hdl.handle.net/1721.1/13636

Internet

http://hdl.handle.net/1721.1/13636

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